Photonic integration is a core technology which enables a wide range of the technological disruptions that are currently transforming our society such as optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others.

All these technologies rely on photonic integration to miniaturise their components, lower their cost, improve performance, increase data speeds and lower energy consumption.

However, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification and support in these areas is crucial for the industry to live up to its enormous growth potential.

• SET AccuraM – die bonder. Die bonding using multiple techniques with 3 µm post-bond position accuracy. 
• Die preparation: Facet Polishing: Krelltech Nova flexible angle polisher
• Digital 3D microscope - Keyence VHX-970FN For stand-off 3D imaging

• FS Bondtec 56XXi – Semi-automatic wire bonder with multiple heads. wedge-wedge & ball-wedge. Minimum pitch in general: 60 μm. Ribbon bonding also accessible, with the minimm pitch depending on the ribbon width.

• Nanosystech Nanoglue – 2x6 axes (XYZ, Roll, Pitch, Yaw) 3D alignment machine with adhesive dispenser and LED UV curing. Resolution: 20 nm on X, Y, and Z axes. 
• Suruga EW60 for flexible R&D alignment - Manual alignment with 25-nm step size - reconfigurable for flexibility 
• Ficontec C2000 (from Late 2025) - Highly automatable 2x6 axis alignment, glue dispensing and curing combined with advanced through-chip laser soldering capabilities for multichip hybrid assemblies, the most advanced 3D photonic assembly machine currently on the market.  

• Keysight tunable laser source with optical power-meters, supporting polarization-Lambdascan measurement

• SET FC150 Platinum - high accuracy die bonder with 0.7 µm precision for chip-to-chip coupling
• Cryostat with optical and electrical feedthroughs
• Nanoscribe GT+ Two-photon Direct Writer, Maskless Lithography
• Plasma cleaning - Tepla 300
• Keyence VK-X3100 - 3D Optical Profiler, nm-scale 3D profiling
• Electron microscopes - Zeiss Supra 55VP & Hitachi Regulus 8230
• PSI/ANAXAM 3D nano x-ray & neutron imaging - nm-scale through sample imaging

The Advanced Manufacturing Technology Transfer Center (AM-TTC) Alliance funds a series of technology centers across Switzerland. Each center specializes in a different technology and aims to support the Swiss industry in innovation in their field.

In 2022 the Swiss photonics community got together to establish a competence center to address their common challenges with micro optical integration and the new AM-TTC Swiss PIC was born.

Swiss PIC is located in Park InnovAARE, next to the Paul Scherrer Institute, Villigen, Aargau, Switzerland