packaging fab

Swiss Photonics Integration Center

 
Bridging photonic innovation to market-ready modules with advanced packaging and integration services - from first concept to scalable product.
 

    ▸ Production-grade infrastructure
    ▸ ISO 6 packaging facility
    ▸ Industrial processes
    ▸ Strong design & customization
    ▸ Ultra-high RF bandwidth
    ▸ Fastest turnaround
 

Contact us now at /sav0led9s@a1swq-isc6s-g+pig*c.a+che

Services

PIC Packaging

Flexible, ultra-high RF PIC packaging and evaluation solutions to enable fast system-level testing and transition to industrialized modules

Quantum Photonics Packaging

Mechanically and thermally stable integration solutions for low-loss quantum-grade photonic systems

Micro optical assembly

High-precision alignment and attachment of optical components for robust, scalable photonic modules
Standardized PIC package

Ready-to-use PIC reference package based on proven processes, minimizing risk, cost, and time-to-market while maintaining maximal flexibility
  • Quick turn-around
  • Adaptable to any size of chip
  • Flexibility for 1 – 8 RF channels
  • Up to 145GHz capability
  • Up to 64 DC connections
Optical connections
  • Single fiber, fiber array, mode-matching interposer
  • Edge or grating coupling
  • Up to three fiber arrays
Match-box sized version out now!

Cost-effective alternative to semi-hermetic gold box packages, ideally suited for EOM applications

 

4ch RF evaluation board

Terminated RF Board

Small EOM Board

Custom 1ch with lid

Capabilities
Industrial processes for the entire photonic assembly with state-of-the-art post-bond position accuracy. Multiple machines and techniques available in ISO-6 packaging facility:
  • Die bonding: Options ranging from epoxy-based, face-up or flipchip, Au stud bumping, In room-T soldering, to optional facet polishing for die and fiber preparation
  • Wire bonding: Our semi-automatic machines are equipped with multiple heads: wedge-wedge, ball-wedge & ribbon bonding.
  • Fiber attachments: Several 2x6 axes (XYZ, Roll, Pitch, Yaw) 3D alignment machines offer various degrees of automation and processes ranging from standard adhesive dispensing and LED UV curing to advanced through-chip laser soldering capabilities for multichip hybrid assemblies. Resolution down to 20 nm on X, Y, and Z axes.
  • Testing: Keysight tunable laser sources with optical powermeters and polarization control. Electro-optical modulation characterization using DC power sources, AWGs, oscilloscope...
CUSTOMER SUCCESS

Polariton

A world-record electro-optical modulation speed of 1 THz was recently demonstrated on this plasmonic chip platform - we're getting ready for packaged modules

Miraex

This exploratory photonic package was developed for reliable fiber attachments at temperatures down to 10 mK - only one of our many quantum-space packages

Luxtelligence

CSEM

News

Swissphotonics Lunch Chat – Swiss PIC

May 26 At the next Swissphotonics Lunch Chat, Swiss PIC will present how we turn photonic ideas into market ready modules.

Quantum physics students visiting

April 26 Future quantum physicists exploring photonics packaging in our cleanroom

Customer Testimonial by Luxtelligence

April 26 We are proud of our strong collaboration with Luxtelligence.
Close news archive ...

News Archive

May 26 Swissphotonics Lunch Chat – Swiss PIC At the next Swissphotonics Lunch Chat, Swiss PIC will present how we turn photonic ideas into market ready modules. • More ...
April 26 Quantum physics students visiting Future quantum physicists exploring photonics packaging in our cleanroom • More ...
April 26 Customer Testimonial by Luxtelligence We are proud of our strong collaboration with Luxtelligence. • More ...
April 26 Successful team retreat in Wengen The Swiss PIC team stepped away from day‑to‑day execution for our team retreat in Wengen • More ...
April 26 SQI Voucher with ETH Zurich Featured in Spotlight Cryogenic photonic packaging comes with its own unique challenges but we are proud to share that we are handling this for our customers at ETH Zurich as well as others... • More ...
March 26 Customers' packages at OFC This OFC was the first time our packages could be found on the booths of our customers. • More ...
March 26 New High-Speed EOM Package at OFC 2026 The last months we have been working closely with Luxtelligence to develop this compact RF package and we are excited to reveal it at OFC. Get in touch if you want us to develop similar solutions for your PIC. • More ...
February 26 Celebrating a new milestone on linkedin We’re excited to celebrate a new milestone: 3,000 people are now part of the Swiss PIC community on LinkedIn! • More ...
February 26 Open PhD student position at Swiss PIC Come join our Swiss PIC team as a PhD student developing exciting new photonic packaging solutions and frequency combs in silicon carbide a new material with the potential for better integration and lower energy consumption than current photonic circuits. • More ...
December 25 Year-end message from Polariton Thank you Polariton for your kind words on our collaboration. We are happy to fight to push the limits on PIC high frequency performance with you! • More ...
December 25 Polariton Technologies reconfirms the high-speed capability Polariton Technologies reconfirms the high-speed capability of its plasmonic PIC technology, measuring electro-optic bandwidth beyond 110 GHz on a silicon photonics platform. The cutting-edge characterization equipment was hosted by Swiss PIC. • More ...
December 25 SiCPIC PhD network starting Swiss PIC is thrilled to be part of the SiCPIC PhD network were we are recruiting a PhD student to develop new packaging technologies for SiC frequency combs together with Politecnico di Torino • More ...
December 25 Tyndall Award awarded to Graham Reed At Swiss PIC we are thrilled to see that this years Tyndall Award have been awarded to Graham Reed, one of the pioneers of the high speed PIC field which we also love dearly. Much deserved! Congratulations! • More ...
November 25 Successful Swiss PIC packaging Fab inauguration Our long awaited inauguration of the Swiss PIC packaging Fab is in full swing. People are arriving, the labs are ready for the tours and the photographers are busy getting pictures for the news posts. Thank you to all our staff who worked hard and our many partners who have supported us with equipment and devices to show the capabilities of the Swiss ecosystem. • More ...
November 25 Countdown to packaging fab inauguration It is busy days at Swiss PIC! The countdown is on for our packaging fab inauguration on November 24th. • More ...
September 25 Photonics Innovation & Test Solutions Event We are happy today to host the first Keysight & Computer Controls Photonics Innovation & Test Solutions Event and bring together a good slice of the PIC community of Switzerland. • More ...
Careers

Interested in joining Swiss PIC?

We’re always happy to connect with talented and passionate individuals. If you are interested in what we do, feel free to reach out via email, we look forward to hearing from you.

Internship/Student Positions Available

Join the Swiss PIC team for a 6 to 12 month internship or Master’s project to help develop next-generation photonic packaging solutions. We’re looking for motivated future engineers ready to take on impactful challenges.
About us

Advanced Manufacturing Technology Transfer Center

The Advanced Manufacturing Technology Transfer Center (AM-TTC) Alliance funds a series of technology centers across Switzerland. Each center specializes in a different technology and aims to support the Swiss industry in innovation in their field.

In 2022 the Swiss photonics community got together to establish a competence center to address their common challenges with micro optical integration and the new AM-TTC Swiss PIC was born.

Swiss PIC is located in Park InnovAARE, next to the Paul Scherrer Institute, Villigen, Aargau, Switzerland

Reports
Team
Team members
(From left to right): Artem Kononov (High-Frequency Engineer - LinkedIn), Peter Moselund (CTO/CFO - LinkedIn), Fatemeh Qaderi (High-Frequency Engineer - LinkedIn), Andreas Hugi (CEO - LinkedIn), Markus Scherrer (Photonics Engineer - LinkedIn), Flavia Timpu (Photonics Engineer - LinkedIn), Daniel Hug (Optical Engineer - LinkedIn); not in picture: Christian Bosshard (Board president - LinkedIn), Isabelle Bollier (Process Engineer - LinkedIn), Former members: Darin Merchant (Quantum Master's student), José Ríos Jiménez (Automation Engineer), Christoph Harder (interim CEO)
Board of Directors

Christian Bosshard

President of the Board
Swissphotonics

Claudia Hössbacher

Board member
Polariton

Kirsten Moselund

Board member
PSI/EPFL

Thomas Hessler

Board member
Ligentec
Advisory Board

Peter O’Brien

Tyndall

Tobias Lamprecht

OST

Jürg Leuthold

ETH Zürich

Markus Rossi

AlphaLum
Our founding members
Contact

Address

Swiss PIC
Parkstrasse 1
5234 Villigen
Switzerland

Email

0inn5foe7@se&wiv%ssv*-pe2icy2.cz&omq

Phone

+41 76 2323623

Social Media