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Bridging the gap between photonic chip innovation and market-ready modules, offering advanced packaging technologies and services.

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Swiss Photonics Integration Center

Photonic integration is a core technology which enables a wide range of the technological disruptions that are currently transforming our society such as optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others.

All these technologies rely on photonic integration to miniaturise their components, lower their cost, improve performance, increase data speeds and lower energy consumption.

However, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification and support in these areas is crucial for the industry to live up to its enormous growth potential.

PIC Packaging

Photonic Integrated Chips (PICs) are chips which can perform higher functionalities with light like electronic ICs do with electrons. They require a wide range of highly customized packaging and integration technologies to efficiently handle all their optical, electrical, mechanical and thermal needs. Swiss PIC are specialists in designing interfaces meeting these needs

Quantum Photonics Packaging

The needs for optical quantum processes resemble those for other types of micro optical integration, but in addition quantum processes often need extremely low loss, exotic optical wavelengths, cryogenic cooling and/or a large number of channels. It is a particular focus area for Swiss PIC to deliver these needs

Micro optical bench

Not all optical functions can fit on a chip. Even if they are not based on chips many optical systems benefit from micro packaging as it saves cost, size energy and can make the system less sensitive to vibrations and shocks. Swiss PIC utilizes its competence and equipment to also build up complex micro optical systems for these applications.
Services

Design

Efficient photonic integration requires a good design. Swiss PIC can help design the interfaces of a chip so that they support efficient packaging and model the design to predict expected performance. Finally, we can design processes to implement the proposed packaging process on our equipment.

Packaging/Integration

Swiss PIC has invested in advanced packaging equipment, cleanrooms, and skilled staff to operate these. This allows us to carry out packaging for prototype to pilot series volumes of chips in a cost efficient manner. Ensuring a fully packaged solution which serves the systems optical, electrical mechanical and thermal requirements. Available capabilities see below.

Training

Aside from providing access to advanced packaging services Swiss PIC is also a knowledge hub for optical integration processes. We will conduct trainings in optical packaging processes and equipment use to share our knowledge with our community. Because the better you understand the packaging process the better we can serve you.
Standardized PIC package

Ready-to-use PIC reference package based on proven processes, minimizing risk, cost, and time-to-market while maintaining maximal flexibility.
  • Quick turn-around
  • Adaptable to any size of chip
  • Flexibility for 1 – 8 RF channels
  • Up to 145GHz capability
  • Up to 64 DC connections
Optical connections
  • Single fiber, fiber array, mode-matching interposer
  • Edge or grating coupling
  • Up to three fiber arrays
Match-box sized version coming soon!

 
Capabilities

highest speed

A world-record electro-optical modulation speed of 1 THz was recently demonstrated on the same plasmonic device platform.

CUSTOM PHOTONIC PACKAGING BY SWISSPIC

lowest temperature

This exploratory photonic package was developed for reliable fiber attachments at termperatures down to 10 mK.
Industrial processes for the entire photonic assembly with state-of-the-art post-bond position accuracy. Multiple machines and techniques available in ISO-6 packaging facility:
  • Die bonding: Options ranging from epoxy-based, face-up or flipchip, Au stud bumping, In room-T soldering, to optional facet polishing for die and fiber preparation
  • Wire bonding: Our semi-automatic machines are equipped with multiple heads: wedge-wedge, ball-wedge & ribbon bonding.
  • Fiber attachments: Several 2x6 axes (XYZ, Roll, Pitch, Yaw) 3D alignment machines offer various degrees of automation and processes ranging from standard adhesive dispensing and LED UV curing to advanced through-chip laser soldering capabilities for multichip hybrid assemblies. Resolution down to 20 nm on X, Y, and Z axes.
  • Testing: Keysight tunable laser sources with optical powermeters and polarization control. Electro-optical modulation characterization using DC power sources, AWGs, oscilloscope...
Customer products

Flexible, ultra-high RF PIC packaging and evaluation solutions, enabling fast system-level testing, 
RF-characterization, and transition to industrialized modules. Ready-to-use PIC reference package based on proven processes, minimizing risk, cost, and 
time-to-market

Quantum Photonics Packaging

Mechanically and thermally stable integration solutions for low-loss quantum-grade photonic systems

Design for Manufacturability

Supporting the full path from packaging- and interface-aware design through integration and validation to reliable industrial deployment and fast time-to-market
News

Open PhD student position at Swiss PIC

February 26 Come join our Swiss PIC team as a PhD student developing exciting new photonic packaging solutions and frequency combs in silicon carbide a new material with the potential for better integration and lower energy consumption than current photonic circuits.

Year-end message from Polariton

December 25 Thank you Polariton for your kind words on our collaboration. We are happy to fight to push the limits on PIC high frequency performance with you!

Polariton Technologies reconfirms the high-speed capability

December 25 Polariton Technologies reconfirms the high-speed capability of its plasmonic PIC technology, measuring electro-optic bandwidth beyond 110 GHz on a silicon photonics platform. The cutting-edge characterization equipment was hosted by Swiss PIC.
Close news archive ...

News Archive

February 26 Open PhD student position at Swiss PIC • More ...
December 25 Year-end message from Polariton • More ...
December 25 Polariton Technologies reconfirms the high-speed capability • More ...
December 25 SiCPIC PhD network starting • More ...
December 25 Tyndall Award awarded to Graham Reed • More ...
November 25 Successful Swiss PIC packaging Fab inauguration • More ...
November 25 Countdown to packaging fab inauguration • More ...
September 25 Photonics Innovation & Test Solutions Event • More ...
Careers

Interested in joining Swiss PIC?

We’re always happy to connect with talented and passionate individuals. If you are interested in what we do, feel free to reach out via email, we look forward to hearing from you.

PhD Student in MSCA network SiCPIC

Come join our Swiss PIC team as a PhD student developing exciting new photonic packaging solutions and frequency combs in silicon carbide a new material with the potential for better integration and lower energy consumption than current photonic circuits.
About us

Advanced Manufacturing Technology Transfer Center (AM-TTC)

The Advanced Manufacturing Technology Transfer Center (AM-TTC) Alliance funds a series of technology centers across Switzerland. Each center specializes in a different technology and aims to support the Swiss industry in innovation in their field.

In 2022 the Swiss photonics community got together to establish a competence center to address their common challenges with micro optical integration and the new AM-TTC Swiss PIC was born.

Swiss PIC is located in Park InnovAARE, next to the Paul Scherrer Institute, Villigen, Aargau, Switzerland

Reports
Team
Team members

(From left to right): Darin Merchant (Quantum Master's student), Artem Kononov (Scientific staff), Fatemeh Qaderi (High-Frequency Engineer - LinkedIn), José  Ríos Jiménez (Automation Engineer), Christoph Harder (CEO - LinkedIn), Peter Moselund (CTO/CFO - LinkedIn), Daniel Hug (Optical Engineer - LinkedIn), Markus Scherrer (Photonic Engineer - LinkedIn), Christian Bosshard (Board president)

Board of Directors

Christian Bosshard

President of the Board
Swissphotonics

Claudia Hössbacher

Board member
Polariton

Kirsten Moselund

Board member
PSI/EPFL

Thomas Hessler

Board member
Ligentec
Advisory Board

Peter O’Brien

Tyndall

Tobias Lamprecht

OST

Jürg Leuthold

ETH Zürich

Markus Rossi

AlphaLum
Our founding members
Contact

Address

Swiss PIC
Parkstrasse 1
5234 Villigen
Switzerland

Email

.inu,fox-@sr1wii#ssg6-pp5ict0.cb4omu

Phone

+41 76 2323623

Social Media