packaging fab

Swiss Photonics Integration Center

 
Bridging photonic innovation to market-ready modules with advanced packaging and integration services - from first concept to scalable product.
 

    ▸ Production-grade infrastructure
    ▸ ISO 6 packaging facility
    ▸ Industrial processes
    ▸ Strong design & customization
    ▸ Ultra-high RF bandwidth
    ▸ Fastest turnaround
 

Contact us now at (sal(lec6s@a'swc#isq's-w.piz*c.c%cht

Photonics Packaging Services

PIC Packaging

Flexible, ultra-high RF PIC packaging and evaluation solutions to enable fast system-level testing and transition to industrialized modules

Quantum Photonics Packaging

Mechanically and thermally stable integration solutions for low-loss quantum-grade photonic systems

Micro optical assembly

High-precision alignment and attachment of optical components for robust, scalable photonic modules
Standardized PIC package

Ready-to-use PIC reference package based on proven processes, minimizing risk, cost, and time-to-market while maintaining maximal flexibility
  • Quick turn-around
  • Adaptable to any size of chip
  • Flexibility for 1 – 8 RF channels
  • Up to 145GHz capability
  • Up to 64 DC connections
Optical connections
  • Single fiber, fiber array, mode-matching interposer
  • Edge or grating coupling
  • Up to three fiber arrays
Match-box sized version out now!

Cost-effective alternative to semi-hermetic gold box packages, ideally suited for EOM applications

 

4ch RF evaluation board

Terminated RF Board

Small EOM Board

Custom 1ch with lid

High-Frequency Test & Measurement Service up to 145 GHz
Accelerate your electro-optical device development & validation by professional high-frequency characterization
  • Electrical & electro-optical characterization up to 145 GHz
  • Probe-based testing on wafer- & die-level
  • Calibration, measurement execution, and data analysis
Our experts provide accurate measurements, calibration, and data analysis to support R&D, product verification, and performance benchmarking
  • Fast results - Immediate access to advanced high-frequency measurement capabilities
  • Low risk - Avoid significant capital expenditure while evaluating and validating new technologies
  • Expert support - Benefit from experienced engineers handling calibration, measurement setup, and data interpretation
Interested in testing your devices? Contact us to discuss your requirements
Capabilities
Industrial processes for the entire photonic assembly with state-of-the-art post-bond position accuracy. Multiple machines and techniques available in ISO-6 packaging facility:
  • Die bonding: Epoxy-based, face-up or flipchip, Gold stud bumping, Indium RT soldering, optional facet polishing for die and fiber preparation
  • Wire bonding: Our semi-automatic machines are equipped with multiple heads: wedge-wedge, ball-wedge & ribbon bonding
  • Fiber attachments: Several 2x6 axes (XYZ, Roll, Pitch, Yaw) 3D alignment machines offer various degrees of automation and processes ranging from standard adhesive dispensing and LED UV curing to advanced through-chip laser soldering capabilities for multichip hybrid assemblies. Resolution down to 20 nm on X, Y, and Z axes
  • Testing: Tunable laser sources with optical powermeters and polarization control. Electro-optical testing using DC power sources, AWG, oscilloscope, EDFA, ...
  • 145 GHz: Electrical / electro-optical characterisation with calibration and fixture de-embedding, connectorized devices and probe
Customer Success

Polariton

A world-record electro-optical modulation speed of 1 THz was recently demonstrated on this plasmonic chip platform - we're getting ready for packaged modules

Miraex

This exploratory photonic package was developed for reliable fiber attachments at temperatures down to 10 mK - only one of our many quantum-space packages

Luxtelligence

High-speed RF package from first concept to final product in 5 weeks - excellence in both package speed to >100 GHz RF bandwidth and packaging turn-around

CSEM

Custom gold box as miniaturized RF package incl. TEC, NTC and precision die bonding to the RF signal channel
Careers

Interested in joining Swiss PIC?

We’re always happy to connect with talented and passionate individuals. If you are interested in what we do, feel free to reach out via email, we look forward to hearing from you.

Internship/Student Positions Available

Join the Swiss PIC team for a 6 to 12 month internship or Master’s project to help develop next-generation photonic packaging solutions. We’re looking for motivated future engineers ready to take on impactful challenges.
About us

Advanced Manufacturing Technology Transfer Center

The Advanced Manufacturing Technology Transfer Center (AM-TTC) Alliance funds a series of technology centers across Switzerland. Each center specializes in a different technology and aims to support the Swiss industry in innovation in their field.

In 2022 the Swiss photonics community got together to establish a competence center to address their common challenges with micro optical integration and the new AM-TTC Swiss PIC was born.

Swiss PIC is located in Park InnovAARE, next to the Paul Scherrer Institute, Villigen, Aargau, Switzerland

Reports
Swiss PIC Team

No packaging team?

Use ours.

Experienced engineers for RF design, packaging,
fiber attach and EO validation.

Board of Directors

Christian Bosshard

President of the Board
Swissphotonics

Claudia Hössbacher

Board member
Polariton

Kirsten Moselund

Board member
PSI/EPFL

Thomas Hessler

Board member
Ligentec
Advisory Board

Peter O’Brien

Tyndall

Tobias Lamprecht

OST

Jürg Leuthold

ETH Zürich

Markus Rossi

AlphaLum
Contact

Address

Swiss PIC
Parkstrasse 1
5234 Villigen
Switzerland

Email

5ina#fog7@sy7wiv)ssx,-py(ico8.cy2omp

Phone

+41 76 2323623

Social Media